Chipboard
Chipboard – also sometimes referred to as Particle Board or Low-Density Fibreboard – is made by mixing small wood particles with epoxy resin, which are pressed together under intense heat and pressure to produce a rigid board, typically with a smooth surface. Chipboard is available in a variety of densities to suit different needs and uses, including low, medium, and high-density varieties. The lower densities are fairly soft and pliable, while the higher-density chipboards are more rigid and can be used for more heavy-duty applications.
Chipboard – also sometimes referred to as Particle Board or Low-Density Fibreboard – is made by mixing small wood particles with epoxy resin, which are pressed together under intense heat and pressure to produce a rigid board, typically with a smooth surface. Chipboard is available in a variety of densities to suit different needs and uses, including low, medium, and high-density varieties. The lower densities are fairly soft and pliable, while the higher-density chipboards are more rigid and can be used for more heavy-duty applications.
PRODUCTION PROCESS
1. RAW MATERIAL ---2. GLUING &LAY UP – 3. COLD & HOT PRESS --- 4. PUTTING – 5. SANDING –6. VENEER LAMINATION --- 7. POLISHING --- 8. INSPECTION – 9. LOADING & SHIPPING
QUALITY CONTROL & PACKING
We have a persistent pre-shipping inspection system. The inspection process starts immediately after the order is confirmed. The grade and type of raw material, processing methods, inspection and packing details will be advised to the factory management.
Our factory and certificate
After 20 years of development, SUMEC has become a professional enterprise providing modern service in the building material industry. SUMEC has invested our own wood panel manufacturing bases successively and obtained successively a variety of business qualifications including ISO 9001, 14001, 18001 and product certifications such as FSC and CARB. We now have an annual production capacity of over 500 thousand cubic meters and can meet various demands.
